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AMI THIN WALL PACKAGING 2016 CONFERENCE    


2016-09-22

 

Applied Market Information [AMI] has unveiled the programme for the 11th  European edition of its Thin Wall Packaging conference. AMI’s Thin Wall Packaging 2016 will be taking place 29 November-1 December 2016 in Cologne, Germany. After record-breaking attendance in 2015, this event is expected to continue to attract attendees from across the global supply chain.

 

Industry experts will gather at this international conference and exhibition for lightweight plastic tubs, trays, and cups for the food packaging industry.

 

AMI will open the conference with a presentation on the European market. This will be followed by two major TWP end-users (Danone and Group Bel), giving their perspective on how to leverage new technologies and materials to bring added value for the consumer as well as increase sustainability.

 

Single serve beverage capsules are a growing and high-margin application for TWP suppliers, and an attractive space for technological, material and design advances. Plastic Technologies and Sacmi will give presentations targeted specifically for this supply chain.

 

AMI's TWP conference has become a powerful platform for converters to show-case innovation. This year's event will host such significant players as  Kloeckner Pentaplast, Faerch Plast, Buergofol and ITC Packaging. Topics will include using PET sheet in chilled dairy, ready meals, meat and delicatessen - as an innovative and sustainable alternative. ITC Packaging, a fast-growing injection moulder, will share its success story of the spoon cap concept.  Moreover, Mitsui Chemicals will discuss functional tie resins for added value multilayer packaging.

 

Decoration technology goes hand in hand with TWP innovation. Verstraete In Mould Labels, the world's largest IML printer, will discuss how IML can be used to prevent counterfeiting. Illig Maschinenbau, the leading thermoforming machinery supplier, will present an update on the implementation of the T-IML technology, whereas CBW Automation will discuss alternative label handling technologies.

 

Improving sustainability is an ever-present challenge for the industry. Petcore Europe will present the a new approach towards a circular PET cycle concept, which will be followed by NGR Next Generation Recycling Maschinen's paper on upcycling of PET thermoforming production scrap. Piovan will talk about a new sustainable and efficient size reduction and granulation solutions.  

 

Last but not least, tool makers such as Roth and Stacktech will complete the technology innovation session, accompanied by Gr8 Engineering shedding light on future applications of ICM.

 

AMI’s Thin Wall Packaging 2016 is relevant for all members of the supply chain including brand owners, retailers, packaging companies, food experts, researchers, test houses, materials and manufacturing experts. In addition to delivering quality papers, the conference also offers superb and cost-effective networking opportunities with its extensive table top exhibition area.

 

Thin Wall Packaging 2016 is sponsored by Borealis, Kiefel Extrusion and SML